FCT Solder

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FCT Solder manufactures a full line of leaded and lead-free solder products. We supply SN100C and 63/37 solder bars, leaded and lead-free solder pastes, SN100C solder wire, fluxes for leaded and lead-free applications and accessory products.

FCT Solder is one of Nihon Superior’s few Global Partners and is a licensee of their SN100C (Sn-Cu-Ni+Ge) patented technology. We pride ourselves on our knowledge of SN100C and its applications, as well as our growing relationship with Nihon Superior. Our ability to manufacture and supply SN100C products allows FCT Solder to offer our customers the highest quality products on the market.

Lead-Free & Leaded Technologies

Click on the following products to download the technical datasheets and MSDS in PDF format.

Neutral pH. Good activity. Free rinsing.

Low foaming. Neutral pH. Good wetting.

Halide free, water soluble, liquid flux.

 

Antioxidant coins to reduce drossing of SN100c solder pots.

Antioxidant pellets for leaded solder, 63/37.

63/37 Bar solder that is cast under an inert atmosphere.

Patented alloy that was invented by Nihon Superior. Tin/Copper alloy doped with Nickel and Germanium.

Top up alloy for SN100c where the copper has reached the upper limit in SN100c specification.

100% Tin Bar mfg. under an inert atmosphere.

Powdered material that minimized and helps separate solder from dross.

No clean rosin free flux that is used for leaded solder. Similar to NC120 but with higher activity.

Rosin free. Good wetting. Low residue.

No clean rosin free flux that is very cosmetically appealing.

Low rosin content. Good topside wetting. High activity.

Clear residue. Good activity. Low smoking.

No clean solder paste that leaves a clear residue.

No clean solder paste that is probable up to 48 hours. Good printing paste.

Excellent Wetting, Halide free flux that is pin probable. Residue left is clear.

This is similar to the above NC670 product although this has a bit more activity and has less shear thinning so stability is very good.

No clean lead free solder paste that is probable up to 48 hours. Good printing paste.

No clean lead free solder paste that leaves a clear residue.

For reflow in air OR nitrogen. Leaves a crystal clear probe testable flux residue. Eliminates need for cleaning. Low voiding. Good tack.

Excellent wetting, clear residue, no clean paste that can be cleaned.

Rosin activated solder paste.

Pin transfer paste that is low viscosity (300Kcps).  

Tip tinner cleans and re-tins solder tips

VOC free no clean flux for wave soldering.

Water based. Low residue. Excellent wetting.

Easy rinsing. High Activity.

Leaded water soluble solder paste that has good activity and free rinsing.

Water soluble solder paste for lead free alloys.

Long stencil life 35-65% RH. Stable viscosity. Low voiding. Excellent wetting. Cosmetically appealing.

Water soluble solder paste that works well in dry and humid climates.

Long stencil life 35-70% RH. Stable viscosity. Low voiding. Less hydroscopic. Slump resistant. Developed for high humidity conditions.

Long stencil life 35-65% RH. Stable viscosity. Low voiding. Room temperature stable up to 4 weeks. Excellent wetting. Slump resistant.

Rosin activated flux for wave and post soldering.